Japan DENSO and United Electronics Company USJC Announce Cooperation! Accelerate mass production and shipment of automotive chips!

Published on: 2023-05-12 15:16
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With the rapid popularization of new energy electric vehicles, automobile manufacturers are striving to improve powertrain efficiency while also paying attention to the cost-effectiveness of electric vehicles. On the 10th, DENSO, a globally renowned automotive electronics supplier, and USJC, a subsidiary of Lianhua Electronics Japan, jointly announced at USJC's wafer factory in Sanchong Prefecture, Japan that the insulated gate bipolar transistor (IGBT) jointly produced by the two companies has entered mass production at USJC's 12 inch wafer factory.

DENSO President Youma Haoer stated that he is pleased to participate in the shipment celebration ceremony and witness the firm partnership between DENSO, UMC, and USJC. Talents from both the semiconductor and automotive industries, with mutual respect and honest cooperation, have become the source of our competitiveness. Looking ahead, DENSO will continue to collaborate with trusted partners to contribute to the semiconductor supply chain, further accelerate the digitization of mobile methods, and continue to meet challenges for protecting the Earth's environment and creating a smiling social mission.

USJC General Manager Tomoyo Kono stated that USJC is honored to become the first wafer factory in Japan to manufacture IGBTs on 12 inch wafers, providing higher production efficiency compared to producing on 8 inch wafers. Thank you to the professional team of USJC and the support from DENSO. We have been able to complete trial production and reliability testing as scheduled, and proceed with mass production on time as agreed with the customer.

Wang Shi, the joint general manager of Liandian, pointed out that we are honored to become a strategic partner of DENSO, a leader in automotive solutions. This cooperation fully demonstrates Liandian's manufacturing capabilities and a close cooperation model to ensure customer success. Driven by the trend of automotive electronics and autonomous driving, it is expected that the content of automotive IC will continue to increase, especially for products with special processes of 28 nanometers and above. As a leader in special manufacturing processes, Liandian is ready to play a more important role in the automotive value chain, assisting partners in seizing the opportunity to win market share in this rapidly developing industry.

This is a ceremony held for the first shipment of critical power semiconductors for electric vehicles, following the establishment of a strategic partnership between the two companies last year, to commemorate this important milestone. The production line jointly invested by DENSO and USJC is responsible for producing the new generation IGBT developed by DENSO. Compared to early components, the new generation IGBT can reduce power consumption by 20%. It is expected that by 2025, the monthly production will reach 10000 wafers.

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